Experimental and numerical investigations into the transient multi-wafer batch atomic layer deposition process with vertical and horizontal wafer arrangements

Dongqing Pan; Lulu Ma; Yuanyuan Xie; Fenfen Wang; Tien-Chien Jen; Chris Yuan

Experimental and numerical investigations into the transient multi-wafer batch atomic layer deposition process with vertical and horizontal wafer arrangements

Dongqing Pan
, Lulu Ma
, Yuanyuan Xie
, Fenfen Wang
, Tien-Chien Jen
, Chris Yuan

Department of Engineering, Engineering Technology, Interior Architecture, and Surveying

University of Wisconsin–Milwaukee

Research output: Contribution to journal › Article › peer-review

Original language	American English
Pages (from-to)	416-427
Number of pages	12
Journal	International Journal of Heat and Mass Transfer
Volume	91
State	Published - 2015

Cite this

@article{7d1dd865382442eebd66b7be08a4220c,

title = "Experimental and numerical investigations into the transient multi-wafer batch atomic layer deposition process with vertical and horizontal wafer arrangements",

author = "Dongqing Pan and Lulu Ma and Yuanyuan Xie and Fenfen Wang and Tien-Chien Jen and Chris Yuan",

year = "2015",

language = "American English",

volume = "91",

pages = "416--427",

journal = "International Journal of Heat and Mass Transfer",

issn = "1879-2189",

publisher = "Elsevier Ltd.",

}

TY - JOUR

T1 - Experimental and numerical investigations into the transient multi-wafer batch atomic layer deposition process with vertical and horizontal wafer arrangements

AU - Pan, Dongqing

AU - Ma, Lulu

AU - Xie, Yuanyuan

AU - Wang, Fenfen

AU - Jen, Tien-Chien

AU - Yuan, Chris

PY - 2015

Y1 - 2015

M3 - Article

SN - 1879-2189

VL - 91

SP - 416

EP - 427

JO - International Journal of Heat and Mass Transfer

JF - International Journal of Heat and Mass Transfer

ER -